FSAE Electronics Enclosure Design: VCU & Telemetry

This project focused on designing enclosures for two key vehicle electronics systems: the Vehicle Control Unit (VCU) and the BEVO telemetry system. I designed both housings from scratch to package sensitive electronics into durable, serviceable enclosures that could survive vehicle integration and competition use.

The enclosures needed to protect electronics from water, heat, vibration, and wire-management issues while still allowing connector access, serviceability, cooling, and reliable mounting to the car. The goal was to create housings that were functional, manufacturable, and integrated cleanly with the rest of the vehicle.

I designed and 3D printed PETG enclosures for the VCU and BEVO telemetry system. The designs packaged boards, wiring, connectors, antennas, a Raspberry Pi, ventilation features, and supporting hardware into compact housings that could be mounted on the vehicle and accessed for maintenance.

I designed and 3D printed PETG enclosures for the VCU and BEVO telemetry system. The designs packaged boards, wiring, connectors, antennas, a Raspberry Pi, ventilation features, and supporting hardware into compact housings that could be mounted on the vehicle and accessed for maintenance.

The final designs packaged the VCU and telemetry electronics into cleaner, more robust enclosures with improved sealing, wire management, and accessibility. The project strengthened vehicle integration while giving the electrical systems more professional and reliable packaging.

Refine packaging based on in-car feedback, improve thermal management and cable organization, and iterate future enclosure designs using lessons from assembly and competition.